Draft Details
- EXPLOSIVE ATMOSPHERES – Part 11: Equipment pro...
- DRAFT STANDARD
- Legal Notice for Draft Standards
- + 1 Scope
- Table 1 – Applicability of specific clauses of ...
- 2 Normative references
- + 3 Terms, definitions and abbreviated terms
- 3.1 Terms and definitions
- 3.2 Abbreviated terms
- Table 2 – List of abbreviated terms used
- 4 Equipment grouping, classification and Levels...
- + 5 Ignition compliance requirements
- 5.1 General
- + 5.2 Conditions for assessment
- 5.2.1 General
- 5.2.2 Level of Protection "ia"
- 5.2.3 Level of Protection "ib"
- 5.2.4 Level of Protection "ic"
- 5.2.5 Non-shock hazard equipment or systems
- + 5.3 Spark ignition compliance
- 5.3.1 General
- 5.3.2 Levels of Protection "ia" and "ib"
- 5.3.3 Level of Protection "ic"
- + 5.3.4 Application of safety factors
- 5.3.4.1 Safety factor 1,0
- 5.3.4.2 Safety factor 1,5
- 5.3.5 Circuits without controlled semiconductor...
- 5.3.6 Circuits with controlled semiconductor li...
- + 5.4 Thermal ignition compliance
- 5.4.1 General
- 5.4.2 Temperature of small components for Group...
- 5.4.3 Wiring within intrinsically safe apparatu...
- Table 3 – Temperature classification of copper ...
- 5.4.4 PCB tracks for Group I and Group II
- Table 4 – Temperature classification of tracks ...
- 5.4.5 Intrinsically safe apparatus and componen...
- Table 5 – Maximum permitted power dissipation w...
- 5.5 Simple apparatus
- + 6 Apparatus construction
- 6.1 General
- + 6.2 Enclosures
- 6.2.1 General
- 6.2.2 Apparatus complying with Table 7
- 6.2.3 Apparatus complying with Table 8 or Table...
- 6.2.4 Enclosures for Group IIIC intrinsically s...
- + 6.2.5 Protection of separations
- 6.2.5.1 Protection by enclosure
- 6.2.5.2 Protection by other means
- + 6.3 Connection facilities for external circuits...
- 6.3.1 Terminals
- Figure 1 – Separation at terminals
- 6.3.2 Earth Terminals
- 6.3.3 Plugs and sockets
- 6.3.4 Permanently connected cable
- + 6.3.5 Connections and accessories for intrinsic...
- 6.3.5.1 General
- 6.3.5.2 Protection against spark ignition while...
- 6.3.5.3 Protection of components on which intri...
- + 6.4 Internal connections and connectors
- 6.4.1 General
- + 6.4.2 Infallible connections
- 6.4.2.1 General
- 6.4.2.2 Connectors
- Figure 2 – Examples of independent and non-inde...
- 6.4.2.3 Wiring
- 6.4.2.4 Printed circuit boards
- Table 6 – Requirements for infallible circuit b...
- 6.4.2.5 Other connections
- 6.4.3 Connectors for internal connections, plug...
- 6.4.4 Earth conductors and connections
- + 6.5 Separation of conductive parts
- 6.5.1 Separations on which intrinsic safety dep...
- 6.5.2 Separation distances according to Table 7...
- + 6.5.3 Reduced separation distances
- 6.5.3.1 General
- 6.5.3.2 Reduced separation distances according ...
- 6.5.3.3 Reduced separation distances for Level ...
- + 6.5.4 Failure of separations
- 6.5.4.1 General
- 6.5.4.2 Infallible separations
- 6.5.4.3 Distances according to Table 7
- 6.5.4.4 Distances according to Table 8
- 6.5.4.5 Distances according to Table 9
- Table 7 – Clearances, creepage distances and se...
- Table 8 – Reduced separations
- Table 9 – Reduced separations for Level of Prot...
- Figure 3 – Example of separation of conductive ...
- 6.5.5 Voltage between conductive parts
- + 6.5.6 Types of separation
- 6.5.6.1 Clearance
- 6.5.6.2 Separation distances through casting co...
- 6.5.6.3 Separation distances through solid insu...
- 6.5.6.4 Creepage distance
- Table 10 – Creepage distance and clearance X in...
- Figure 4 – Determination of creepage distances ...
- 6.5.6.5 Separations distances protected by coat...
- 6.5.7 Composite separations
- 6.5.8 5 Printed circuit board assemblies
- Figure 5 – Creepage distances and clearances on...
- + 6.5.9 Separation by metal parts
- 6.5.9.1 General
- 6.5.9.2 Levels of Protection "ia" and "ib"
- 6.5.9.3 Level of Protection "ic"
- 6.5.10 Separation by non-metallic insulating pa...
- + 6.5.11 Insulation of internal wiring
- 6.5.11.1 General
- 6.5.11.2 Insulation between intrinsically safe ...
- 6.5.11.3 Insulation between separate intrinsica...
- + 6.6 Encapsulation
- 6.6.1 General
- + 6.6.2 Encapsulation used for the exclusion of e...
- 6.6.2.1 Protection against spark ignition
- Figure 6 – Encapsulation used without a separat...
- Figure 7 – Complete enclosure with no user remo...
- Figure 8 – Enclosure where the compound forms o...
- Figure 9 – Enclosure with cover
- Figure 10 – Moulding over un-mounted components...
- Figure 11 – Moulding over components mounted on...
- 6.6.2.2 Additional requirements for protection ...
- 6.6.3 Mechanical protection to avoid access to ...
- 6.6.4 Encapsulation used for protection of a fu...
- 6.6.5 Encapsulation used to provide separation
- 6.6.6 Encapsulation used to enhance the rating ...
- + 6.6.7 Free space within the encapsulation
- 6.6.7.1 General
- 6.6.7.2 Volume of free space
- 6.6.7.3 Protection of free space
- Table 11 – Minimum thickness of compound adjace...
- Table 12 – Minimum thickness of compound adjace...
- 6.7 Specification of coating, encapsulation mat...
- 6.8 Protection against polarity reversal
- 6.9 Dielectric strength requirement
- + 7 Characteristics and failure of components and...
- 7.1 Rating of components on which intrinsic saf...
- 7.2 Failure of components
- 7.3 Manufacturing variation
- + 7.4 Resistors
- 7.4.1 General
- 7.4.2 Resistors on which intrinsic safety depen...
- Table 13 – Rating and failure modes of resistor...
- + 7.5 Capacitors
- 7.5.1 General
- 7.5.2 Capacitors on which intrinsic safety depe...
- Table 14 – Rating and failure modes of capacito...
- 7.5.3 Blocking capacitors
- 7.5.4 Infallible filter capacitors
- + 7.6 Inductors and windings
- 7.6.1 General
- 7.6.2 Inductors on which intrinsic safety depen...
- Table 15 – Rating and failure modes of inductor...
- 7.6.3 Infallibly insulated inductors
- 7.6.4 Damping windings
- + 7.6.5 Common mode choke coils (EMI suppression ...
- 7.6.5.1 General
- 7.6.5.2 Infallible common mode chokes
- + 7.7 Semiconductors
- 7.7.1 Failure of semiconductors
- 7.7.2 Semiconductors on which intrinsic safety ...
- Table 16 – Rating and failure modes of semicond...
- 7.7.3 Transient effects on semiconductors on wh...
- 7.7.4 Semiconductors in shunt voltage limiters
- 7.7.5 Shunt assembly on which intrinsic safety ...
- 7.7.6 Safety assemblies infallible against fail...
- 7.7.7 Semiconductor current limiters
- 7.7.8 Use of programmable components
- + 7.8 Transformers
- 7.8.1 General
- 7.8.2 Transformers on which intrinsic safety de...
- 7.8.3 Construction of transformers on which int...
- Table 17 – Minimum foil thickness or minimum wi...
- + 7.8.4 Protective measures for transformers on w...
- 7.8.4.1 Mains transformers
- 7.8.4.2 Transformers galvanically isolated from...
- 7.8.5 Requirements for transformers for Level o...
- + 7.9 Relays
- 7.9.1 General
- 7.9.2 Relays on which intrinsic safety depends
- + 7.10 Signal isolators
- 7.10.1 General
- 7.10.2 Signal isolators on which intrinsic safe...
- Table 18 – Rating and failure modes of signal i...
- 7.10.3 Signal isolators between intrinsically s...
- 7.10.4 Signal isolators between separate intrin...
- 7.11 Fuses
- + 7.12 Primary and secondary cells and batteries
- 7.12.1 General
- 7.12.2 Construction of cells and batteries used...
- 7.12.3 Electrolyte leakage
- 7.12.4 Ventilation
- 7.12.5 Cell voltages
- 7.12.6 Batteries in equipment protected by diff...
- 7.12.7 Batteries used and replaced in explosive...
- 7.12.8 Replaceable batteries used but not repla...
- 7.12.9 External contacts for charging batteries...
- 7.13 Piezoelectric devices
- + 7.14 Cells for the detection of gases
- 7.14.1 Electrochemical
- 7.14.2 Catalytic
- 7.15 Supercapacitors
- + 7.16 Thermal devices
- 7.16.1 General
- + 7.16.2 Thermal devices used to limit temperatur...
- 7.16.2.1 General
- 7.16.2.2 Temperature sensors
- Table 19 – Rating and failure modes of temperat...
- 7.16.2.3 Switching thermal devices
- Table 20 – Rating and failure modes of switchin...
- 7.16.2.4 PTC devices used to limit temperature
- Table 21 – Rating and failure modes of PTC devi...
- 7.16.3 PPTC devices used to limit current
- Table 22 – Rating and failure modes of PPTC dev...
- 7.17 Mechanical switches
- + 8 Supplementary requirements for specific appar...
- + 8.1 Diode safety barriers
- 8.1.1 General
- + 8.1.2 Construction
- 8.1.2.1 Mounting
- 8.1.2.2 Facilities for connection to earth
- 8.1.2.3 Protection of components
- 8.2 FISCO apparatus
- + 9 Type verifications and type tests
- + 9.1 Spark ignition test
- 9.1.1 General
- 9.1.2 Spark test apparatus and its use
- + 9.1.3 Test gas mixtures and spark test apparatu...
- 9.1.3.1 Explosive test mixtures and calibration...
- Table 23 – Compositions of explosive test mixtu...
- 9.1.3.2 Explosive test mixtures and calibration...
- Table 24 – Compositions of explosive test mixtu...
- + 9.2 Spark ignition assessment using reference c...
- 9.2.1 General
- + 9.2.2 Assessment of simple resistive circuit
- 9.2.2.1 General
- Figure 12 – Example of a simple resistive circu...
- 9.2.2.2 Example simple resistive circuit assess...
- + 9.2.3 Assessment of simple capacitive circuits
- 9.2.3.1 General
- Figure 13 – Example of simple capacitive circui...
- 9.2.3.2 Example of simple capacitive circuit as...
- 9.2.3.3 Permitted reduction of effective capaci...
- Figure 14 – Effective capacitance
- Table 25 – Permitted reduction of effective cap...
- + 9.2.4 Assessment of Simple Inductive Circuits
- 9.2.4.1 General
- Figure 15 – Example of simple inductive circuit...
- 9.2.4.2 Example of simple inductive circuit ass...
- 9.2.5 Determination of Lo/Ro for resistance lim...
- 9.2.6 Circuits with both inductance and capacit...
- 9.3 Temperature tests
- + 9.4 Mechanical tests
- 9.4.1 Casting compound
- 9.4.2 Acceptability of encapsulated or coated f...
- 9.4.3 Partitions
- 9.4.4 Cable pull test
- 9.5 Current carrying capacity of infallible pri...
- 9.6 Dielectric strength tests
- + 9.7 Qualification of solid insulation and dista...
- 9.7.1 General
- + 9.7.2 Preconditioning
- 9.7.2.1 Dry heat preconditioning
- 9.7.2.2 Dry heat cycle preconditioning
- 9.7.2.3 Rapid change of temperature preconditio...
- 9.7.2.4 Humidity preconditioning
- 9.7.3 AC power frequency voltage test
- 9.7.4 Partial discharge test
- Figure 16 – Test voltages
- 9.8 Type tests for PCB coatings
- 9.9 Differential Leakage current tests for sign...
- Figure 17 – Recommended bias circuit for Differ...
- + 9.10 Isolator tests
- 9.10.1 General
- + 9.10.2 Thermal conditioning and dielectric test...
- 9.10.2.1 General
- 9.10.2.2 Overload test at the receiver side
- 9.10.2.3 Overload test at the transmitter side
- 9.10.2.4 Thermal conditioning and dielectric st...
- + 9.10.3 Dielectric and short circuit test
- 9.10.3.1 General
- 9.10.3.2 Pre-test dielectric
- 9.10.3.3 Short circuit current test
- 9.10.3.4 Dielectric strength test
- 9.11 Tests for intrinsically safe apparatus con...
- 9.12 Tests for PTC devices
- 9.13 Determination of parameters of loosely spe...
- + 9.14 Tests for cells, batteries and supercapaci...
- + 9.14.1 Conditions for testing
- 9.14.1.1 General
- 9.14.1.2 Tests without dust layers
- 9.14.1.3 Tests with dust layers
- 9.14.1.4 Additional tests
- 9.14.2 Electrolyte leakage test for cells, batt...
- + 9.14.3 Spark ignition and surface temperature o...
- 9.14.3.1 General
- 9.14.3.2 Spark ignition assessment
- 9.14.3.3 Thermal ignition assessment
- 9.14.4 Battery container pressure tests
- 9.14.5 Battery resistance
- 9.15 Determination of storable energy in common...
- Figure 18 – Inductor test circuit
- Figure 19 – Measured oscillation
- 9.16 Type tests for components protected by tim...
- + 9.17 Transformer tests
- 9.17.1 General
- + 9.17.2 Mains transformers for Level of Protecti...
- 9.17.2.1 Mains transformers operated at mains f...
- 9.17.2.2 Mains transformers operated at non-mai...
- 9.17.2.3 Acceptance criteria
- 9.17.3 Transformers galvanically isolated from ...
- 9.17.4 Transformers for Level of Protection "ic...
- + 10 Routine verifications and tests
- 10.1 Alternative reduced spacings
- + 10.2 Routine tests for diode safety barriers
- 10.2.1 Completed barriers
- 10.2.2 Diodes for 2-diode "ia" barriers
- + 10.3 Routine tests for transformers
- 10.3.1 Levels of Protection "ia" and "ib"
- Table 26 – Routine test voltages for transforme...
- 10.3.2 Level of Protection "ic"
- 10.4 Routine verification of conformal coating ...
- + 11 Marking
- + 11.1 Intrinsically safe apparatus and associate...
- 11.1.1 General
- 11.1.2 Intrinsic safety parameters
- 11.1.3 FISCO
- 11.1.4 Marking of connection facilities
- 11.1.5 Non-hazardous area accessory
- 11.2 Warning markings
- Table 27 – Text of warning markings
- + 12 Instructions
- 12.1 General
- 12.2 Specific Conditions of Use
- Table 28 – Concerns addressed by Specific Condi...
- + Annex A (normative) Spark ignition reference c...
- Figure A.1 – Resistive circuits
- Figure A.2 – Group I capacitive circuits
- Figure A.3 – Group II capacitive circuits
- Figure A.4 – Inductive circuits of Group II
- Figure A.5 – Group I inductive circuits
- Figure A.6 – Group IIC inductive circuits
- Table A.1 – Permitted short circuit current cor...
- Table A.2 – Permitted capacitance corresponding...
- + Annex B (normative) Spark test apparatus for i...
- B.1 Principle
- B.2 Spark test apparatus
- B.3 Spark test apparatus sensitivity
- B.4 Preparation and cleaning of tungsten wires
- B.5 Conditioning a new cadmium disc
- B.6 Limitations of the spark test apparatus
- B.7 Modification of spark test apparatus for us...
- Figure B.1 – Spark test apparatus for intrinsic...
- Figure B.2 – Cadmium contact disc
- Figure B.3 – Wire holder
- Figure B.4 – Example of a practical design of s...
- Figure B.5 – Arrangement for fusing tungsten wi...
- + Annex C (informative) Measurement of creepage ...
- C.1 Clearances and separation distances through...
- Figure C.1 – Measurement of clearance
- Figure C.2 – Measurement of composite distances...
- C.2 Creepage distances
- Figure C.3 – Measurement of creepage
- Figure C.4 – Composite separation including cre...
- C.3 Examples for the application of an ambient ...
- Figure C.5 – PCB with two coated components des...
- Figure C.6 – PCB with 3 mm slot designed for am...
- + Annex D (normative) Excess transient energy te...
- D.1 Overview
- Table D.1 – Energy limits by equipment group
- D.2 Circuit configuration
- Figure D.1 – Example circuit configuration
- D.3 Test equipment
- D.4 Test load
- D.5 Supply voltage
- D.6 Supply change tests
- D.7 Load change tests
- D.8 Transient energy calculation
- Figure D.2 – Example output voltage, current, p...
- + Annex E (normative) FISCO – Apparatus requirem...
- E.1 Overview
- + E.2 Apparatus requirements
- E.2.1 General
- + E.2.2 FISCO power supplies
- E.2.2.1 General
- E.2.2.2 Additional requirements of "ia" and "ib...
- Table E.1 – Assessment of maximum output curren...
- E.2.2.3 Additional requirements of "ic" FISCO p...
- Table E.2 – Assessment of maximum output curren...
- + E.3 FISCO field devices
- E.3.1 General
- E.3.2 Additional requirements of "ia" and "ib" ...
- E.3.3 Additional requirement of "ic" FISCO fiel...
- E.3.4 Terminator
- E.3.5 Simple apparatus
- Figure E.1 – Typical FISCO system
- + Annex F (normative) Ignition testing of semico...
- F.1 Overview
- F.2 Initial test
- F.3 Subsequent tests
- Table F.1 – Terms used in Annex F
- F.4 Examples of pass and fail
- Table F.2 – Sequence of tests
- Table F.3 – Safety factor provided by several e...
- Table F.4 – Example of a Group I circuit with c...
- Table F.5 – Example of a Group I circuit with c...
- Figure F.1 – Safety factor vs ignition probabil...
- + Annex G (normative) Universal output character...
- G.1 Overview
- G.2 Linear source
- G.3 Non-linear source
- Figure G.1 – Example of an output characteristi...
- G.4 Curves
- Figure G.2 – Limit curve diagram for universal ...
- Figure G.3 – Limit curve diagram for universal ...
- + Annex H (informative) Examples of marking
- H.1 General
- H.2 Self-contained intrinsically safe apparatus...
- H.3 Intrinsically safe apparatus supplied by ot...
- H.4 Associated apparatus
- H.5 Associated apparatus protected by a flamepr...
- H.6 Intrinsically safe apparatus Level of Prote...
- H.7 Intrinsically safe apparatus Level of Prote...
- + H.8 FISCO
- H.8.1 Power supply
- H.8.2 Field device
- H.8.3 Terminator
- H.8.4 Dual marked field device
- + Annex I (informative) Overview of tests on enc...
- Figure I.1 – Tests for enclosures or parts of e...
- Figure I.2 – Tests for enclosures or parts of e...
- + Annex DVJ (normative in Canada)
- DVJ.1 General
- DVJ.2 Associated equipment
- DVJ.3 Intrinsically safe equipment
- DVJ.4 Markings
- Bibliography
1DV DR Modification of Clause 1 to replace with the following:
This part of IEC 60079 standard specifies the construction and testing of intrinsically safe apparatus intended for use in explosive atmospheres, and for associated apparatus which is intended for connection to intrinsically safe circuits which enter such atmospheres.
This Type of Protection is applicable to electrical equipment in which the electrical circuits themselves are incapable of causing ignition of a surrounding explosive atmosphere. This includes electrical equipment which contains circuits that are intrinsically safe only under certain conditions, for example under battery supply with mains supply removed.
This document is also applicable to electrical equipment or parts of electrical equipment located outside the explosive atmosphere or protected by another Type of Protection listed in IEC 60079-0 UL 60079-0 and CSA C22.2 No. 60079-0, where the intrinsic safety of the electrical circuits in the explosive atmosphere may depend upon the design and construction of such electrical equipment or parts of such electrical equipment. The electrical circuits exposed to the explosive atmosphere are assessed for use in such atmospheres by applying this document.
This document applies to sensors connected to intrinsically safe circuits but does not apply to the protection of catalytic elements for Group IIC or Group IIB + H2.
This document does not apply to Ex Equipment cable glands.
The requirements for intrinsically safe systems are provided in IEC 60079-25 UL 60079-25 and CSA C22.2 No. 60079-25.
This document supplements and modifies the general requirements of IEC 60079-0, UL 60079-0 and CSA C22.2 No. 60079-0 except as indicated in Table 1. Where a requirement of this document conflicts with a requirement of IEC 60079-0 UL 60079-0 and CSA C22.2 No. 60079-0, the requirement of this document takes precedence.
Unless otherwise stated, the requirements in this document are applicable to both intrinsically safe apparatus and associated apparatus, and the generic term "apparatus" is used throughout the standard.
As this document applies only to electrical equipment, the term "equipment" used in the standard always means "electrical equipment".
This document applies to apparatus for use under the atmospheric conditions of IEC 60079-0 UL 60079-0 and CSA C22.2 No. 60079-0 with additional requirements for use at extended atmospheric pressures in the range from 60 kPa (0,6 bar), up to 110 kPa (1,1 bar).
Where references are made to other IEC standards, the referenced requirements found in these standards apply as modified by any applicable US National Differences for the standard (see Clause 2).
You may comment on any section of this document by clicking the “Submit Comment” link at the bottom of the relevant section.